SHAD is a lifelong experience and begins with our month-long summer program, which will show you what you can achieve if you think big and pursue your extraordinary potential.
Each year, top-performing Grades 10, 11 and 12 students (Secondaire IV, V, or CEGEP 1 in Quebec) or the international equivalent, compete for a place in the month-long program, which is focused on STEAM (science, technology, engineering, arts & math) disciplines. Approximately 900 students are accepted annually to participate and live in-residence on one of our host university campuses across Canada during the July program.
“SHAD is a time in your life when anything you think of can become a reality. I really believe if you go through high school without SHAD, you’re not getting the complete experience. It’s that essential. You have to go!” - Bruce Gao, SHAD '12
SHAD provides the unique opportunity to explore a university campus while still in high school, and experience higher learning in a supportive yet challenging environment. Included are lectures, seminars and workshops, presentations by industry leaders, working in teams to simulate a ‘startup’ project, and recreational activities. Meanwhile, parents can rest assured that SHAD works intensively with our university campus partners to ensure student safety, well-being, and access to needed services.
The SHAD Entrepreneurship Challenge is part of the program: teams of participants will collaborate, innovate and create a product or service by applying scientific principles, engineering a prototype, and developing business and marketing plans. A winning team is selected at each campus to polish off their projects for the SHAD - John Dobson Entrepreneurship Cup held each fall. Take a look at last year's SHAD Cup in Pictures.
SHAD participants are also eligible for a volunteer summer internship for the month of August, immediately following the July in-residence university program.
The Application is extensive, and is due November 20, 2017. For more info, visit https://www.shad.ca/Apply.htm.
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